CSP three major structures and existing LED alternative

More LED information, please click Real Green Lighting Company Limited


CSP stands for Chip Scale Package, Chinese meaning is chip-level packaged devices, refer to the package size of less than 1.2 times the size of the chip package devices, the largest shipments of Samsung LM-131A chip size is 0.78 * 0.78mm, package size 1.42 * 1.42, strictly speaking, the current mainstream chip vendors package size do not meet this requirement, so called CSP somewhat rigorous. No name for the packaged chip is introduced from Taiwan, because the chip has not been a traditional solid crystal and wire these packaging processes, and therefore not known packaged chip.

No CSP packaged chip three major structures

The first camp: the use of silicone phosphor repression, five-sided light, high luminous efficiency, color temperature consistency control but the top and around the poor. Currently BDO Runda CSP is this based.

The second camp: titanium dioxide to protect the area around the fluorescent film and then covered only the top of a light-emitting surface, light consistency and directional well, but lost around light output, efficiency will be low. Samsung mainly based on this technology, but also in the development of the first technique BDO Runda. BDO Runda also developing this technology, Samsung products.

The third camp: The fluorescent film full coverage, plus a fixed transparent silicone molding, also face a five-light, high luminous efficiency, light quality somewhat less, this section mainly Philips uses.

It is worth mentioning that, in addition to the market there is a self-proclaimed CSP is with the substrate, although you can also do a small volume, but not the final form.

Three applications to replace the traditional LED

CSP is the earliest use of the backlight and flash current Apple and Samsung mobile phones are using flash-free CSP packaged chip, CSP thin Samsung and LG TV part of the package without using the chip. In the lighting industry, CSP because of small size, high flexibility, range of applications will be more extensive. At present mainly in three areas:

First, it can directly replace the power and high power.

The second is the more stars arranged in a matrix, substitute COB, because the spacing between lamp beads, temporarily unable to meet the requirements of a particularly high spot small angle spotlights. But according to head of research and development Fuhai Yong Sui-ming said that this section CSP COB technology still has a chance to replace the imaging of the reasons a good solution.

Matrix arrangement

The third is the CSP plus lens, replace the panel light inside the small power.